hi-sincerity microelectronics corp. spec. no. : he6108 issued date : 1997.09.05 revised date : 2001.08.13 page no. : 1/3 HA8550 hsmc product specification HA8550 pnp epitaxial planar transistor description the HA8550 is designed for use in 2w output amplifier of portable radios in class b push-pull operation. features ? high total power dissipation (pt: 2w, tc=25 c) ? high collector current (ic: 1.5a) ? complementary to ha8050 absolute maximum ratings ? maximum temperatures storage temperature ....................................................................................................... -55 ~ +150 c junction temperature................................................................................................ +150 c maximum ? maximum power dissipation total power dissipation (ta=25 c)................................................................................................... 1 w total power dissipation (tc=25 c) ................................................................................................... 2 w ? maximum voltages and currents (ta=25 c) vcbo collector to base voltage................................................................................................. ... -40 v vceo collector to emitter voltage.............................................................................................. ... -25 v vebo emitter to base voltage................................................................................................... ...... -6 v ic collector current .......................................................................................................... ........... -1.5 a ib base current ................................................................................................................ ............ -0.5 a characteristics (ta=25 c) symbol min. typ. max. unit test conditions bvcbo -40 - - v ic=-100ua bvceo -25 - - v ic=-2ma bvebo -6 - - v ie=-100ua icbo - - -100 na vcb=-35v iebo - - -100 na veb=-6v *vce(sat) - - -0.5 v ic=-0.8a, ib=-80ma *vbe(sat) - - -1.2 v ic=-0.8a, ib=-80ma vbe(on) - - -1 v vce=-1v, ic=-10ma *hfe1 45 - - vce=-1v, ic=-5ma *hfe2 85 - 500 vce=-1v, ic=-100ma *hfe3 40 - - vce=-1v, ic=-800ma ft 100 - - mhz vce=-10v, ic=-50ma, f=100mhz *pulse test : pulse width 380us, duty cycle 2% classification on hfe2 rank c d e range 120-200 160-320 250-500
hi-sincerity microelectronics corp. spec. no. : he6108 issued date : 1997.09.05 revised date : 2001.08.13 page no. : 2/3 HA8550 hsmc product specification characteristics curve current gain & collector current 10 100 1000 0.1 1 10 100 1000 10000 collector curremt-i c (ma) hfe saturation voltage & collector current 1 10 100 1000 10000 0.1 1 10 100 1000 10000 collector current-i c (ma) saturation voltage (mv) v be(sat) @ i c =10i b v ce(sat) @ i c =10i b on voltage & collector current 100 1000 10000 1 10 100 1000 10000 collector current-i c (ma) on voltage (mv) v be(on) @ v ce =1v cutoff frequency & collector current 10 100 1000 1 10 100 1000 collector current-i c (ma) cutoff frequency (mhz) v ce =10v capcitance & reverse-biased voltage 1 10 100 0.1 1 10 100 reverse-biased voltage (v) capacitance (pf) cob safe operating area 1 10 100 1000 10000 1 10 100 forward voltage-v ce (v) collector current-i c (ma) pt=1ms pt=100ms pt=1s
hi-sincerity microelectronics corp. spec. no. : he6108 issued date : 1997.09.05 revised date : 2001.08.13 page no. : 3/3 HA8550 hsmc product specification to-92 dimension *:typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1704 0.1902 4.33 4.83 g 0.0142 0.0220 0.36 0.56 b 0.1704 0.1902 4.33 4.83 h - *0.1000 - *2.54 c 0.5000 - 12.70 - i - *0.0500 - *1.27 d 0.0142 0.0220 0.36 0.56 1 - *5 - *5 e - *0.0500 - *1.27 2 - *2 - *2 f 0.1323 0.1480 3.36 3.76 3 - *2 - *2 notes : 1.dimension and tolerance based on our spec. dated apr. 25,1996. 2.controlling dimension : millimeters. 3.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.if there is any question with packing specification or packing method, please contact your local hsmc sales office. material : ? lead : 42 alloy ; solder plating ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of hsmc. ? hsmc reserves the right to make changes to its products without notice. ? hsmc semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? hsmc assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. head office and factory : ? head office (hi-sincerity microelectronics corp.) : 10f.,no. 61, sec. 2, chung-shan n. rd. taipei taiwan r.o.c. tel : 886-2-25212056 fax : 886-2-25632712, 25368454 ? factory 1 : no. 38, kuang fu s. rd., fu-kou hsin-chu industrial park hsin-chu taiwan. r.o.c tel : 886-3-5983621~5 fax : 886-3-5982931 3 1 a d b c i 1 e f 2 3 g h 2 style : pin 1.emitter 2.base 3.collector 3-lead to-92 plastic package hsmc packa g e code : a marking : hsmc logo part number date code product series rank laser mark hsmc logo part number product series ink mark
|
